Zn-based lead-free solder and semiconductor power module

Zn系无铅焊料和半导体功率模块

Abstract

To obtain a Zn-based lead-free solder which has a practical melting point range of 300-350 DEG C. A Zn-based lead-free solder which contains 0.05-0.2 wt%of Cr, 0.25-1.0 wt% of Al, 0.5-2.0 wt% of Sb, 1.0-5.8 wt% of Ge and 5-10 wt% of Ga; or a Zn-based lead-free solder which contains 0.05-0.2 wt% of Cr, 0.25-1.0 wt% of Al, 0.5-2.0 wt% of Sb, 1.0-5.8 wt% of Ge and 10-20 wt% of In.
本发明得到实用的熔点范围为300~350℃的Zn系无铅焊料。Zn系无铅焊料,其含有:0.05~0.2wt%的Cr、0.25~1.0wt%的Al、0.5~2.0wt%的Sb、1.0~5.8wt%的Ge、和5~10wt%的Ga。或者,Zn系无铅焊料,其含有:0.05~0.2wt%的Cr、0.25~1.0wt%的Al、0.5~2.0wt%的Sb、1.0~5.8wt%的Ge、和10~20wt%的In。

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